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II: Newest machines and lines imported from Germany and Japan.

III: Strict feature control at each process.

PCB Capability of SYS Technology



Capability of Rigid PCB

Serial Item Technical Data
1 Types of Products FR4 Multilayer PCB, Aluminum PCB,
Flexible PCB, Special Material PCB,
Buried/Blind Via PCB,High Frequency PCB
2 Layers 128(layers)
3 Max. Board Size 520x1500mm
4 Max. Board Thickness 3.2mm
5 Min. Board Thickness 4layers0.40mm 16mil
0.80mm 32mil
1.00mm 40mil
layers1.20mm 48mil
6 Copper Clad(Max.) 8 oz(outer)/4 oz(inner)
7 Min. line Width/space 0.075mm/0.075mm 3mil/3mil
8 Drill Size Mechanical (min.) 0.15mm 6mil
9 Drill Size Laser(min.) 0.10mm 4mil
10 PTH Wall Thickness 0.025mm 1mil
11 PTH dia tolerance ±0.075mm ±3mil
12 NPTH hole dia tolerance ±0.05mm ±2mil
13 Hole Position Deviation ±0.05mm ±2mil
14 Outline Tolerance ±0.10mm ±4mil
15 S/M Pitch 0.08mm 3mil
16 Insulation Resistance 1E+12Ω(Normal)
17 Test Voltage 50~300V
18 Aspect ratio 12:1
19 Thermal Shock 3x10Sec@288
20 Warp and Twist 0.7%
21 Current breakdown 10A
22 Electric Strength 1.3KV/mm
23 Peel Strength 1.4N/mm
24 Solder Mask Abrasion 6H
25 Solder Mask Color Green, White, Yellow, Red
Black, Blue, Purple.
26 Silkscreen Color White, Yellow, Black
27 Flammability 94V-0
28 Impedance Control  +/-10%(50Ohm) +/-5% (50Ohm)
29 Buried Via Yes
30 Blind Via Yes
31 HDI 2+N+2 4mil Via hole
32 Surface Finished ENIG,IMS,ImSn,OSP,HASL-LF,Carbon ink
ENEPIG,Plating Gold
33 Materials FR4, Aluminum,Polymide,Rogers etc.




Capability of Flexible PCB


Item Technical Data
1 Layer Flex board: 1-4Layers
2 Material PI, PET, PEN, FR-4
3 Final Thickness Flex board: 0.002" - 0.1" (0.05-2.5mm)
4 Surface Treatment Lead-free HAL, ENIG, OSP, Immersion silver, Immersion Tin
5 Max. / Min. Board Size Min: 0.2"x0.3"  Max: 20.5"x13"
6 Min. Trace Inner: 0.5oz: 4/4mil  Outer: 1/3oz-0.5oz: 4/4mil
7 Width / Min. Clearance 1oz: 5/5mil               1oz: 5/5mil
2oz: 5/7mil               2oz: 5/7mil
8 Min. Hole Ring Inner: 0.5oz: 4mil     Outer: 1/3oz-0.5oz: 4mil
1oz: 5mil                  1oz: 5mil
2oz: 7mil                  2oz: 7mil
9 Copper Thickness 1/3oz - 2oz
10 Max. / Min. Insulation Thickness 2mil/0.5mil (50um/12.7um)
11 Min. Hole Size and Tolerance Min hole: 8mil
Tolerance: PTH±3mil, NPTH±2mil
12 Min. Slot 24mil x 35mil (0.6x0.9mm)
13 Solder Mask Alignment Tolerance ±3mil
14 Silkscreen Alignment Tolerance ±6mil
15 Silkscreen Line Width 5mil
16 Gold Plating Nickel: 100u" - 200u", Gold: 1u"-4u"
17 Immersion Nickel / Gold Nickel: 100u" - 200u",Gold: 1u"-5u"
18 Immersion Silver Silver: 6u" - 12u"
19 OSP Film: 8u" - 20u"
20 Test Voltage Testing Fixture: 50-300V
21 Profile Tolerance of Punch Accurate mould: ±2mil
Ordinary mould: ±4mil
Knife mould: ±8mil
Hand-Cut: ±15mil


Capability of Components Assembly
Item Mass  production (mm) Sample& Small order (mm)
SMT PCB Length*Width Min. 50*30 L50 Or W30
Max. 450*350 450L800 Or 350W400
Thickness Min. 0.8 T0.8
Max. 5 T5
DIP PCB Length*Width Min. 50*30 L50
Max. 500*300 500L1000 Or 300W450
Thickness Min. 0.8 T0.8
Max. 5 T5
Surface Mount Device  Size Min. 06030201 040201005
Max. 45*45 45*45Size68*6845*150
Thickness 25.4 T25.4
QFP/SOP/SOJ/IC/Socket etc. Min. PIN Distance Pitch=0.4 Pitch=0.3
CSPBGA Min. Tin Ball Distance Pitch=0.5 0.3Pitch0.5
PCB Type FR4FPCRigid-Flex PCBMetal Core PCB